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FINEPLACER® femto has the best cost – performance ratio of its class in the market. It is an ideal system for a production environment as well as for product and process development, accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification. This award winning system offers modular application architecture and can be flexibly equipped for a wide range of applications and processes. 12″).įINEPLACER ® femto 2 Automated Sub-micron Die Bonder The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applications. The FJ520 is designed with the flexibility for a wide range of applications and the possible requirements of future products in mind (e.g. The substantial experience of the Hesse GmbH in transducer development and ultrasonic technology, combined with the routine in building complex machines for fully automatic production has made this development possible.
#DATACON 2200 EVO REFURBISH FULL#
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#DATACON 2200 EVO REFURBISH PLUS#
Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the 2200 evo is prepared for present and future processes and products.ĮSEC 2100 FC PLUS Esec as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100 family of die bonders: Esec’s response to driving down the cost of flip chip technology.